NPM-W2 / NPM-W2S
Higher productivity and quality thanks to the integration of printing, placement and inspection processes make the NPM-W2 one of the most flexible and versatile pick-and-place solutions on the market.
This machine provides the user with a tool that allows him to choose between high speed or high accuracy, depending on the PCB requirements.
In addition, the NPM-W2 is optimised for larger boards and larger components, such as PCBs up to 750 x 550 mm and components up to 150 x 25 x 30 mm (L,W,H). For high productivity, dual lanes can be used.
Features
The multifunctional NPM-W2 is equipped with a 12-nozzle head and can place 38,500 components. 120 feeders can be mounted.
Additionally, the NPM-W2 can automatically inspect solder depots and components according to the production data.
As a third function, the NPM can be fitted with the conventional HDF discharge mechanism, which ensures high-quality non-contact dispensing with a screw valve-dispenser.
This platform is also available as a single-beam solution:
NPM-W2S single beam allows various operations ranging, from NPM-series backup to multiple connection configuration.
Features
Equipped with a 16-nozzle head and can place 42,000 components
Automatical inspection of solder depots and components according to the production data
HDF discharge mechanism compatible, which ensures high-quality non-contact dispensing with a screw valve-dispenser
Specifications
| PCB dimensions (mm) | Single-lane Batch mounting 2-position mounting Dual-lane Dual transfer (Batch) Dual transfer (2-position) Single transfer (Batch) Single transfer (2-position) |
| Placement Head max Speed | 42 000cph (0.094 s/ chip) |
| Placement Head Placement Accuracy (Cpk≧1) | ±40 μm / chip |
| Placement Head Component Dimensions (mm) | 0402 chip ~ L 6 x W 6 x T 3 |
| Taping | Tape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mm Max.120 (Tape: 4, 8 mm) |
| Dispensing Head | Dispensing speed: Dot dispensing: 0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation) Draw dispensing: 4.25 s/component (Condition : 30 mm x 30 mm corner dispensing)*9 Adhesive position accuracy (Cpk≥1) Dot Dispensing: ± 75 μ m /dot Draw Dispensing: ± 100 μ m /component Applicable components Dot Dispensing: 1608 chip to SOP,PLCC,QFP, Connector, BGA, CSP Draw Dispensing: BGA, CSP |
| Resolution | 2D inspection head (A) 18 µm |
| View Size (mm) | 44.4 x 37.2 |
| Inspection Processing Time | Solder Inspection 0.35s/ View size Component Inspection 0.5s/ View size |
| Inspection Object | Solder Inspection Chip component: 100 μm × 150 μm or more (0603 or more) Package component: φ150 μm or more Component Inspection: Square chip (0603 or more), SOP, QFP (a pitch of 0.4mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector |
| Inspection Items | Solder Inspection: Oozing, blur, misalignment, abnormal shape, bridging Component Inspection: Missing, shift, flipping, polarity, foreign object inspection |
| Inspection Position Accuracy | ± 20 μm |
| No of Inspection | Solder Inspection : Max. 30 000 pcs./machine (No. of components :Max. 10 000 pcs./machine) Component Inspection: Max. 10 000 pcs./machine |